Electrical Characteristics (Notes 2, 9) (Continued)
Note 7: Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 105
oC), the maximum power
dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the
following equation: TA-MAX =TJ-MAX-OP –(θJA xPD-MAX).
Note 8: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues.
Note 9: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 10: CIN,COUT,C1, and C2 : Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
Note 11: Efficiency is measured versus VIN, with VIN being swept in small increments from 3.0V to 4.2V. The average is calculated from these measurement results.
Weighting to account for battery voltage discharge characteristics (VBAT vs. Time) is not done in computing the average.
Note 12: There is a 300k
Ω pull-down resistor connected internally between the EN pin and GND.
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