Moteur de recherche de fiches techniques de composants électroniques |
|
TPS389033QDSERQ1 Fiches technique(PDF) 4 Page - Texas Instruments |
|
|
TPS389033QDSERQ1 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 26 page 4 TPS3890-Q1 SBVS303A – MARCH 2017 – REVISED OCTOBER 2017 www.ti.com Product Folder Links: TPS3890-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage VDD –0.3 7 V SENSE –0.3 7 RESET –0.3 7 MR –0.3 7 VCT –0.3 7 Current RESET –20 20 mA Temperature Operating junction, TJ –40 125 °C Operating ambient, TA –40 125 Storage, Tstg –65 150 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±750 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Power-supply voltage 1.5 5.5 V VSENSE SENSE voltage 0 5.5 V VRESET RESET pin voltage 0 5.5 V IRESET RESET pin current –5 5 mA CIN Input capacitor, VDD pin 0 0.1 µF CCT Reset timeout capacitor, CT pin 0 26 µF RPU Pullup resistor, RESET pin 1 1000 kΩ TJ Junction temperature (free-air temperature) –40 25 125 ℃ (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TPS3890-Q1 UNIT DSE (WSON) 6 PINS RθJA Junction-to-ambient thermal resistance 321.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 207.9 °C/W RθJB Junction-to-board thermal resistance 281.5 °C/W ψJT Junction-to-top characterization parameter 42.4 °C/W ψJB Junction-to-board characterization parameter 284.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 142.3 °C/W |
Numéro de pièce similaire - TPS389033QDSERQ1 |
|
Description similaire - TPS389033QDSERQ1 |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |