4

TPS25820, TPS25821

SLVSE24 – NOVEMBER 2017

www.ti.com

Product Folder Links: TPS25820 TPS25821

Submit Documentation Feedback

Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range, voltages are respect to GND (unless otherwise noted)

(1)

MIN

MAX

UNIT

Pin voltage, V

IN, EN, CHG, REF, OUT, FAULT, CC1, CC2, SINK, POL

–0.3

6

V

OUT, REF, CC1, CC2

Internally

limited

A

2.5

A

1

A

FAULT, SINK, POL

Internally

limited

mA

–40

180

°C

–65

150

°C

(1)

Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by assembly line electrostatic discharges into

the device.

(2)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

(4)

Surges per IEC61000-4-2, 1999 applied between CC1/CC2 and output ground of the TPS25820EVM-835.

6.2 ESD Ratings

VALUE

UNIT

(1)

Electrostatic

discharge

±2000

V

±500

±8000

±15000

6.3 Recommended Operating Conditions

Voltages are with respect to GND (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

IN

4.5

5.5

V

Input voltage

EN, CHG

0

5.5

V

High-level input voltage

EN, CHG

2

V

Low-level voltage

EN, CHG

0.8

V

Pull-up voltage

Used on FAULT, SINK, POL

0

5.5

V

Positive source current

OUT

1.5

A

250

mA

Positive sink current (100 ms

moving average)

SINK, POL

5

mA

FAULT

10

Internally

Limited

mA

Operating junction temperature

–40

125

°C