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TCAN1043-Q1, TCAN1043H-Q1, TCAN1043HG-Q1, TCAN1043G-Q1

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SLLSEV0 – OCTOBER 2017

Product Folder Links: TCAN1043-Q1 TCAN1043H-Q1 TCAN1043HG-Q1 TCAN1043G-Q1

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Copyright © 2017, Texas Instruments Incorporated

7.4 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Battery supply (reverse blocked) voltage range

4.5

60

V

5V Supply Voltage

4.5

5.5

Supply voltage range – by char CAN functionality to support cold crank events

4

4.5

I/O supply voltage

2.8

5.5

Logic terminal HIGH level output current – RXD and nFAULT

–2

mA

Logic terminal LOW level output current – RXD and nFAULT

2

INH output current

1

100

nF

Operational free-air temperature (see Thermal Information) - standard version

–40

125

°C

Operational free-air temperature (see Thermal Information) - H version

–55

125

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information

TEST CONDITIONS

TCAN1043x-Q1

TCAN1043x-

Q1

UNIT

D (SOIC)

DMT (VSON)

14 Pins

14 Pins

Junction-to-air thermal resistance

Low-K thermal resistance

–

–

°C/W

High-K thermal resistance

78

33.1

Junction-to-board thermal resistance

34.7

10.8

Junction-to-case (top) thermal resistance

33.6

30.5

Junction-to-case (bottom) thermal resistance

–

1.3

Junction-to-top characterization parameter

5.7

0.4

Junction-to-board characterization parameter

34.3

10.7

7.6 Dissipation Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

Average power dissipation

Input to TXD at 500 kHz, 50% duty cycle square wave,

TBD

mW

V, Input to TXD at 500 kHz, 50% duty cycle square wave,

TBD

Thermal shutdown temperature

170

°C

Thermal shutdown hysteresis

10

°C