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SN74AUP1G17 Fiches technique(PDF) 1 Page - Texas Instruments

No de pièce SN74AUP1G17
Description  Low-Power Single Schmitt-Trigger Buffer
Download  39 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

SN74AUP1G17 Fiches technique(HTML) 1 Page - Texas Instruments

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74AUP1G17
SCES579J – JUNE 2004 – REVISED SEPTEMBER 2017
SN74AUP1G17 Low-Power Single Schmitt-Trigger Buffer
1
1 Features
1
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
2000-V Human-Body Model
(A114-B, Class II)
1000-V Charged-Device Model (C101)
Available in the Texas Instruments NanoStar™
Package
Low Static-Power Consumption
(ICC = 0.9 µA Maximum)
Low Dynamic-Power Consumption
(Cpd = 4.4 pF Typical at 3.3 V)
Low Input Capacitance (Ci = 1.5 pF Typical)
Low Noise – Overshoot and Undershoot
<10% of VCC
Ioff Supports Partial-Power-Down Mode Operation
Includes Schmitt-Trigger Inputs
Wide Operating VCC Range of 0.8 V to 3.6 V
Optimized for 3.3-V Operation
3.6-V I/O Tolerant to Support Mixed-Mode Signal
Operation
tpd = 5.1 ns Maximum at 3.3 V
Suitable for Point-to-Point Applications
2 Applications
Grid Infrastructure
PC & Notebooks
Tablets
Factory Automation & Control
Gaming
Server
3 Description
The AUP family of devices is TI's premier solution to
the industry's low-power needs in battery-powered
portable applications. This family ensures a very low
static- and dynamic-power consumption across the
entire VCC range of 0.8 V to 3.6 V, resulting in
increased battery life. This product also maintains
excellent signal integrity (see AUP – The Lowest-
Power Family and Excellent Signal Integrity).
This device functions as an independent gate with
Schmitt-trigger inputs, which allows for slow input
transition and better switching-noise immunity at the
input.
NanoStar™
package
technology
is
a
major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs when the device is powered down. This
inhibits current backflow into the device which
prevents damage to the device.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74AUP1G17DBV
SOT-23 (5)
1.60 mm × 2.90 mm
SN74AUP1G17DCK
SC70 (5)
1.25 mm × 2.00 mm
SN74AUP1G17DRL
SOT-5X3 (5)
1.60 mm × 1.20 mm
SN74AUP1G17DRY
SON (6)
1.00 mm × 1.45 mm
SN74AUP1G17DSF
SON (6)
1.00 mm × 1.00 mm
SN74AUP1G17YFP
DSBGA (4)
0.76 mm × 0.76 mm
SN74AUP1G17YZP
DSBGA (5)
0.89 mm × 1.39 mm
SN74AUP1G17DPW
X2SON (5)
0.80 mm × 0.80 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
(DBV, DCK, DPW, DRL, DRT, DRY, and YZP
Packages)
Logic Diagram (Positive Logic)
(YFP Package)


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