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AMC1106X Fiches technique(PDF) 4 Page - Texas Instruments

No de pièce AMC1106X
Description  Small, High-Precision, Basic Isolated Delta-Sigma Modulators
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

AMC1106X Fiches technique(HTML) 4 Page - Texas Instruments

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4
AMC1106E05, AMC1106M05
SBAS789 – OCTOBER 2017
www.ti.com
Product Folder Links: AMC1106E05 AMC1106M05
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Supply voltage, AVDD to AGND or DVDD to DGND
–0.3
6.5
V
Analog input voltage at AINP, AINN
AGND – 6
AVDD + 0.5
V
Digital output voltage at DOUT, or digital input voltage on CLKIN
DGND – 0.5
DVDD + 0.5
V
Input current to any pin except supply pins
–10
10
mA
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
AVDD
Analog (high-side) supply voltage (AVDD to AGND)
3.0
5.0
5.5
V
DVDD
Digital (controller-side) supply voltage (DVDD to DGND)
2.7
3.3
5.5
V
TA
Operating ambient temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1)
AMC1106x
UNIT
DWV (SOIC)
8 PINS
RθJA
Junction-to-ambient thermal resistance
112.2
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
47.6
°C/W
RθJB
Junction-to-board thermal resistance
60.0
°C/W
ψJT
Junction-to-top characterization parameter
23.1
°C/W
ψJB
Junction-to-board characterization parameter
60.0
°C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance
N/A
°C/W
7.5 Power Ratings
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PD
Maximum power dissipation
(both sides)
AMC1106E05, AVDD = DVDD = 5.5 V
91.85
mW
AMC1106M05, AVDD = DVDD = 5.5 V
86.90
PD1
Maximum power dissipation
(high-side supply)
AVDD = 5.5 V
53.90
mW
PD2
Maximum power dissipation
(low-side supply)
AMC1106E05, AVDD = DVDD = 5.5 V
37.95
mW
AMC1106M05, AVDD = DVDD = 5.5 V
33.00


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