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SI5513DC Fiches technique(PDF) 1 Page - Vishay Siliconix |
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SI5513DC Fiches technique(HTML) 1 Page - Vishay Siliconix |
1 / 7 page Si5513DC Vishay Siliconix Document Number: 71186 S-42138—Rev. F, 15-Nov-04 www.vishay.com 1 Complementary 20-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A) Qg (Typ) N Channel 20 0.075 @ VGS = 4.5 V 4.2 4 N-Channel 20 0.134 @ VGS = 2.5 V 3.1 4 P Channel 20 0.155 @ VGS = −4.5 V −2.9 3 P-Channel −20 0.260 @ VGS = −2.5 V −2.2 3 Bottom View 1206-8 ChipFET r S1 G1 S2 G2 D1 D1 D2 D2 1 Marking Code EB XX Lot Traceability and Date Code Part # Code Ordering Information: Si5513DC-T1 Si5513DC-T1—E3 (Lead (Pb)-Free) S2 G2 D2 P-Channel MOSFET N-Channel MOSFET G1 D1 S1 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) N-Channel P-Channel Parameter Symbol 5 secs Steady State 5 secs Steady State Unit Drain-Source Voltage VDS 20 −20 V Gate-Source Voltage VGS "12 V Continuous Drain Current (TJ = 150_C)a TA = 25_C ID 4.2 3.1 −2.9 −2.1 Continuous Drain Current (TJ = 150_C)a TA = 85_C ID 3.0 2.2 −2.1 −1.5 A Pulsed Drain Current IDM 10 −10 A Continuous Source Current (Diode Conduction)a IS 1.8 0.9 −1.8 −0.9 Maximum Power Dissipationa TA = 25_C PD 2.1 1.1 2.1 1.1 W Maximum Power Dissipationa TA = 85_C PD 1.1 0.6 1.1 0.6 W Operating Junction and Storage Temperature Range TJ, Tstg −55 to 150 _C Soldering Recommendations (Peak Temperature)b, c 260 _C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Mi J ti t A bi ta t v 5 sec R 50 60 Maximum Junction-to-Ambienta Steady State RthJA 90 110 _C/W Maximum Junction-to-Foot (Drain) Steady State RthJF 30 40 C/W Notes a. Surface Mounted on 1” x 1” FR4 Board. b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon- nection. c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. |
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