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AD7616-PBSTZ-RL Fiches technique(PDF) 10 Page - Analog Devices |
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AD7616-PBSTZ-RL Fiches technique(HTML) 10 Page - Analog Devices |
10 / 47 page Data Sheet AD7616-P Rev. 0 | Page 9 of 46 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter Rating V CC to AGND −0.3 V to +7 V V DRIVE to AGND −0.3 V to V CC + 0.3 V Analog Input Voltage to AGND1 ±21 V Digital Input Voltage to AGND −0.3 V to V DRIVE + 0.3 V Digital Output Voltage to AGND −0.3 V to V DRIVE + 0.3 V REFINOUT to AGND −0.3 V to V CC + 0.3 V Input Current to Any Pin Except Supplies1 ±10 mA Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Soldering Reflow Pb/Sn Temperature (10 sec to 30 sec) 240 (+0)°C Pb-Free Temperature 260 (+0)°C ESD All Pins Except Analog Inputs 2 kV Analog Input Pins Only 8 kV 1 Transient currents of up to 100 mA do not cause silicon controlled rectifier (SCR) latch-up. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Close attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 5. Thermal Resistance Package Type θ JA θ JC Unit ST-80-21 41 7.5 °C/W 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board. See JEDEC JESD51. ESD CAUTION |
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Description similaire - AD7616-PBSTZ-RL |
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