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AD7616-PBSTZ-RL Fiches technique(PDF) 10 Page - Analog Devices

No de pièce AD7616-PBSTZ-RL
Description  16-Channel DAS with 16-Bit, Bipolar Input, Dual Simultaneous Sampling ADC
Download  47 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

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Data Sheet
AD7616-P
Rev. 0 | Page 9 of 46
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
V
CC to AGND
−0.3 V to +7 V
V
DRIVE to AGND
−0.3 V to V
CC + 0.3 V
Analog Input Voltage to AGND1
±21 V
Digital Input Voltage to AGND
−0.3 V to V
DRIVE + 0.3 V
Digital Output Voltage to AGND
−0.3 V to V
DRIVE + 0.3 V
REFINOUT to AGND
−0.3 V to V
CC + 0.3 V
Input Current to Any Pin Except
Supplies1
±10 mA
Operating Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
Soldering Reflow
Pb/Sn Temperature (10 sec to 30 sec)
240 (+0)°C
Pb-Free Temperature
260 (+0)°C
ESD
All Pins Except Analog Inputs
2 kV
Analog Input Pins Only
8 kV
1 Transient currents of up to 100 mA do not cause silicon controlled rectifier
(SCR) latch-up.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 5. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
ST-80-21
41
7.5
°C/W
1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board. See JEDEC JESD51.
ESD CAUTION


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