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TPSM82480

SLVSDT1 – JULY 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

All voltages are with respect to network ground terminal.

6 Specifications

6.1 Absolute Maximum Ratings

MIN

MAX

UNIT

VIN

-0.3

6

V

EN, VSEL, MODE, SS/TR, PG, TG

-0.3

6

V

FB, RS

-0.3

3

V

Power Good / Thermal Good Sink Current

PG, TG

10

mA

-40

150

°C

-65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

6.3 Recommended Operating Conditions

MIN

TYP

MAX

UNIT

2.4

5.5

V

0.6

5.5

V

6

A

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

TPSM82480

UNIT

MOP 24 PINS

JEDEC with thermal

vias

Junction-to-ambient thermal resistance

32.2

°C/W

Junction-to-case (top) thermal resistance

13.6

°C/W

Junction-to-board thermal resistance

11.5

°C/W

Junction-to-top characterization parameter

0.53

°C/W

Junction-to-board characterization parameter

11.3

°C/W

Junction-to-case (bottom) thermal resistance

-

°C/W