Qualpack TSC87251G2D

Rev. 0 – October 1999

9

2.6 Wafer Process Control

All the inspections and controls are defined as a process step in the production management software,

and are led by using a centralized SPC software. PC system could be summarized as follows:

Probe

die-sort

Assembly

- NANTES:

hermetic packages

- Subcontractors :

plastic packages

Final Test

Process

parameters

Electrical

Test

Engineering Database

Physical

SPC (xbar / R)

Cpk tracking

Electrical

SPC (xbar / s)

Cpk tracking

Attribute

Physical measurement

SPC (xbar / R)

Cpk tracking

Attribute

Measurement

- NANTES :

hermetic packages

- Subcontractors :

plastic packages

Wafer Fab

Critical process parameters are identified by using F.M.E.A. and other advanced tools.

Those parameters are followed in real time with the SPC methodology and their capability is measured

and monthly reported in the Operation Review.

For end 1999, the Cpk target is the following:

% of all parameters per Cpk categories

0%

20%

40%

60%

80%

100%

1995

1996

1997

1998

Obj. 99

>1.67

<1.67