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TPS75105DSKT Fiches technique(PDF) 2 Page - Texas Instruments |
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TPS75105DSKT Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 27 page 2 TPS75100, TPS75103, TPS75105 SBVS080J – SEPTEMBER 2006 – REVISED NOVEMBER 2016 www.ti.com Product Folder Links: TPS75100 TPS75103 TPS75105 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions ....................... 4 6.4 Thermal Information .................................................. 4 6.5 Electrical Characteristics........................................... 5 6.6 Typical Characteristics .............................................. 6 7 Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 9 7.4 Device Functional Modes.......................................... 9 8 Application and Implementation ........................ 10 8.1 Application Information............................................ 10 8.2 Typical Application .................................................. 12 9 Power Supply Recommendations ...................... 14 10 Layout................................................................... 14 10.1 Layout Guidelines ................................................. 14 10.2 Layout Example .................................................... 14 11 Device and Documentation Support ................. 15 11.1 Device Support...................................................... 15 11.2 Documentation Support ........................................ 15 11.3 Related Links ........................................................ 15 11.4 Receiving Notification of Documentation Updates 15 11.5 Community Resources.......................................... 15 11.6 Trademarks ........................................................... 16 11.7 Electrostatic Discharge Caution ............................ 16 11.8 Glossary ................................................................ 16 12 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision I (November 2013) to Revision J Page • Added Device Information table, Typical Application Diagram title to front-page diagram, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1 • Changed SON to WSON throughout document .................................................................................................................... 1 • Deleted pin out drawings from Typical Application Diagram figure........................................................................................ 1 • Changed I/O status to I from O in D1B row of Pin Functions table ....................................................................................... 3 • Deleted Dissipation Ratings table........................................................................................................................................... 4 Changes from Revision H (January 2010) to Revision I Page • Changed test conditions for ground current parameter in the Electrical Characteristics ....................................................... 5 • Deleted Figure 14; duplicate mechanical image. ................................................................................................................. 12 Changes from Revision G (March 2009) to Revision H Page • Revised ground current parameter, Electrical Characteristics; changed symbol from IQ to IGND; added specifications for YFF and DSK packages.................................................................................................................................................... 5 • Added YFF and DSK package specifications for current matching parameter, Electrical Characteristics ............................ 5 • Changed diode current accuracy parameter, Electrical Characteristics, to reflect YFF and DSK package specifications .... 5 • Deleted operating junction temperature range specification from Electrical Characteristics table to eliminate redundancy . 5 |
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