4

LM337-N-MIL

SNVSAX3 – JUNE 2017

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6 Specifications

6.1 Absolute Maximum Ratings

MIN

MAX

UNIT

Power dissipation

Internally Limited

Input-output voltage differential

–0.3

40

V

Operating junction temperature

0

125

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000

V may actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Operating junction temperature

0

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

No heat sink.

6.4 Thermal Information

LM337-N-MIL

UNIT

NDT

(TO)

DCY

(SOT-223)

NDE OR NDG

(TO-220)

3 PINS

3 PINS

3 PINS

Junction-to-ambient thermal resistance

58.3

22.9

°C/W

Junction-to-case (top) thermal resistance

12

36.6

15.7

°C/W

Junction-to-board thermal resistance

—

7.2

4.1

°C/W

Junction-to-top characterization parameter

—

1.3

2.4

°C/W

Junction-to-board characterization parameter

—

7

4.1

°C/W

Junction-to-case (bottom) thermal resistance

—

—

1

°C/W