Moteur de recherche de fiches techniques de composants électroniques |
|
FIN1217MTD Fiches technique(PDF) 1 Page - Fairchild Semiconductor |
|
FIN1217MTD Fiches technique(HTML) 1 Page - Fairchild Semiconductor |
1 / 17 page © 2004 Fairchild Semiconductor Corporation DS500876 www.fairchildsemi.com October 2003 Revised October 2004 FIN1217 • FIN1218 • FIN1215 • FIN1216 LVDS 21-Bit Serializers/De-Serializers General Description The FIN1217 and FIN1215 transform 21-bit wide parallel LVTTL (Low Voltage TTL) data into 3 serial LVDS (Low Voltage Differential Signaling) data streams. A phase- locked transmit clock is transmitted in parallel with the data stream over a separate LVDS link. Every cycle of transmit clock 21 bits of input LVTTL data are sampled and trans- mitted. The FIN1218 and FIN1216 receive and convert the 3 serial LVDS data streams back into 21 bits of LVTTL data. Refer to Table 1 for a matrix summary of the Serializers and De- serializers available. For the FIN1217, at a transmit clock frequency of 85 MHz, 21 bits of LVTTL data are transmitted at a rate of 595 Mbps per LVDS channel. These chipsets are an ideal solution to solve EMI and cable size problems associated with wide and high-speed TTL interfaces. Features s Low power consumption s 20 MHz to 85 MHz shift clock support s 50% duty cycle on the clock output of receiver s ±1V common-mode range around 1.2V s Narrow bus reduces cable size and cost s High throughput (up to 1.785 Gbps throughput) s Up to 595 Mbps per channel s Internal PLL with no external component s Compatible with TIA/EIA-644 specification s Devices are offered in 48-lead TSSOP packages Ordering Code: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Order Number Package Number Package Description FIN1215MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide FIN1216MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide FIN1217MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide FIN1218MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide |
Numéro de pièce similaire - FIN1217MTD |
|
Description similaire - FIN1217MTD |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |