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XZMDH160S Fiches technique(PDF) 2 Page - SunLED Corporation |
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XZMDH160S Fiches technique(HTML) 2 Page - SunLED Corporation |
2 / 9 page Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 2/9 Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUB- STRATE Absolute Maximum Ratings at TA=25°C Electrical / Optical Characteristics at TA=25°C Part Number Emitting Color (Material) Lens-color Viewing Angle 2 θ 1/2 [1] Code. Min. Max. typ. XZMDH160S Red (AlGaInP) Water Clear B8* 35* 42* 42.7* 120 ° B9* 42* 50* B10* 50* 60* Φv (lm) [2] CIE127-2007* (IF=350mA) Parameter Symbol Value Unit DC Forward Current [1] IF 350 mA Peak Forward Current [2] IFM 500 mA Reverse Voltage VR 5 V Operating Temperature Top -40 To +100 °C Storage Temperature Tstg -40 To +110 °C Junction temperature[1] TJ 110 °C Thermal resistance [1] (Junction/ambient) Rth j-a 80 °C/W Thermal resistance [1] (Junction/solder point) Rth j-s 15 °C/W Power dissipation PD 1.05 W Parameter Symbol Value Unit Wavelength at peak emission CIE127-2007* IF = 350mA [Typ.] λpeak 640* nm Dominant Wavelength CIE127-2007* IF = 350mA [Typ.] λdom [1] 625* nm Spectral bandwidth at 50% Φ REL MAX IF = 350mA [Typ.] △ λ 20 nm Allowable Reverse Current [Max.] IR 85 mA VF [2] V Forward Voltage IF = 350mA [Typ.] 2.5 Forward Voltage IF = 350mA [Max.] 3.0 Temperature coefficient of λpeak IF = 350mA, -10 °C ≤ T ≤ 100°C [Typ.] TCλpeak 0.14 nm/°C Temperature coefficient of λdom IF = 350mA, -10 °C ≤ T ≤ 100°C [Typ.] TCλdom 0.12 nm/°C Temperature coefficient of VF IF = 350mA, -10 °C ≤ T ≤ 100°C [Typ.] TCV -3.0 mV/°C Forward Voltage IF = 350mA [Min.] 2.0 Notes: 1. θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. * Luminous flux is in accordance with CIE127-2007 standards. Notes: 1. Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. * Wavelength value is traceable to CIE127-2007 standards. Notes: 1. Results from mounting on metal core PCB, mounted on pc board-metal core PCB is recommend for lowest thermal resistance. 2. 1/10 Duty Cycle, 0.1ms Pulse Width. 3. A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) |
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Description similaire - XZMDH160S |
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