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INA826S Fiches technique(PDF) 3 Page - Texas Instruments |
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INA826S Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 40 page 1 ±IN 10 +VS 2 RG 9 OUT 3 RG 8 REF 4 +IN 7 ±VS 5 EN 6 ENREF Not to scale Thermal pad 3 INA826S www.ti.com SBOS770A – MAY 2017 – REVISED JUNE 2017 Product Folder Links: INA826S Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated 5 Pin Configuration and Functions DRC Package 10-Pin VSON Top View Pin Functions NAME NO. I/O DESCRIPTION EN 5 I Enable pin; active low with respect to ENREF ENREF 6 I Enable pin reference –IN 1 I Negative (inverting) input +IN 4 I Positive (noninverting) input OUT 9 O Output REF 8 I Reference input. This pin must be driven by low impedance. RG 2, 3 — Gain setting pins. Place a gain resistor between pin 2 and pin 3. –VS 7 — Negative supply +VS 10 — Positive supply Thermal pad Pad — Exposed thermal die pad on underside; connect thermal die pad to V–. Soldering the thermal pad improves heat dissipation and provides specified performance. |
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