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TPS82140SILT Fiches technique(PDF) 4 Page - Texas Instruments

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No de pièce TPS82140SILT
Description  17-V Input 2-A Step-Down Converter MicroSiP Module with Integrated Inductor
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

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TPS82140
SLVSDN3 – JUNE 2017
www.ti.com
Product Folder Links: TPS82140
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground pin.
6 Specifications
6.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Voltage at pins(2)
VIN
-0.3
20
V
EN, SS/TR
-0.3
VIN + 0.3
PG, FB
-0.3
7
VOUT
0
7
Sink current
PG
10
mA
Module operating temperature
–40
125
°C
Storage temperature
–55
125
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-
C101(2)
±1000
(1)
The module operating temperature range includes module self temperature rise and IC junction temperature rise. In applications where
high power dissipation is present, the maximum operating temperature or maximum output current must be derated. For applications
where the module operates continuously at 125 °C temperature, the maximum lifetime is reduced to 50,000 hours.
6.3 Recommend Operating Conditions
MIN
MAX
UNIT
VIN
Input voltage
3
17
V
VPG
Power good pull-up resistor voltage
6
V
VOUT
Output voltage
0.9
6
V
IOUT
Output current
0
2
A
TJ
Module operating temperature range for 100,000 hours lifetime(1)
-40
110
°C
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Theta-JA can be improved with a custom PCB design containing thermal vias where possible.
6.4 Thermal Information
THERMAL METRIC(1)
TPS82140
UNIT
8-Pin SIL
JEDEC 51-5
EVM
RθJA
Junction-to-ambient thermal resistance
58.2
46.1
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
9.4
9.4
°C/W
RθJB
Junction-to-board thermal resistance
14.4
14.4
°C/W
ψJT
Junction-to-top characterization parameter
0.9
0.9
°C/W
ψJB
Junction-to-board characterization parameter
14.2
14.0
°C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance
21.3
21.3
°C/W


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