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TMP100-Q1, TMP101-Q1

SBOS581A – SEPTEMBER 2011 – REVISED MAY 2017

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Copyright © 2011–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input voltage rating applies to all TMP100-Q1 and TMP101-Q1 input voltages.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply, V+

7.5

V

–0.5

7.5

V

Operating temperature

–55

125

°C

150

°C

–60

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±750

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2.7

5.5

V

–55

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TMP100-Q1,

TMP101-Q1

UNIT

DBV (SOT-23)

6 PINS

Junction-to-ambient thermal resistance

182.9

°C/W

Junction-to-case (top) thermal resistance

115

°C/W

Junction-to-board thermal resistance

30.2

°C/W

Junction-to-top characterization parameter

17.1

°C/W

Junction-to-board characterization parameter

29.7

°C/W