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TPS82675SIPT Fiches technique(PDF) 5 Page - Texas Instruments

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No de pièce TPS82675SIPT
Description  600-mA, High-Efficiency MicroSiP Step-Down Converter (Profile <1.0mm)
Download  30 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

TPS82675SIPT Fiches technique(HTML) 5 Page - Texas Instruments

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SIP-8
(TOP VIEW)
SIP-8
(BOTTOMVIEW)
A1
B1
C1
A2
B2
C2
GND
MODE
VOUT
GND
A3
C3
VIN
EN
A3
C3
A2
B2
C2
GND
EN
VIN
GND
C1
VOUT
MODE
A1
B1
5
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J – OCTOBER 2010 – REVISED MAY 2016
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
7 Pin Configuration and Functions
space
space
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
VOUT
A1
O
Power output pin. Apply output load between this pin and GND.
VIN
A2, A3
I
The VIN pins supply current to the TPS8267x internal regulator.
EN
B2
I
This is the enable pin of the device. Connect this pin to ground to force the converter into
shutdown mode. Pull this pin to VI to enable the device. This pin must not be left floating and
must be terminated.
MODE
B1
I
This is the mode selection pin of the device. This pin must not be left floating and must be
terminated.
MODE = LOW: The device is operating in regulated frequency pulse width modulation mode
(PWM) at high-load currents and in pulse frequency modulation mode (PFM) at light load
currents.
MODE = HIGH: Low-noise mode is enabled and regulated frequency PWM operation is forced.
GND
C1, C2, C3
Ground pin.
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
Operation above 4.8V input voltage for extended periods may affect device reliability.
(4)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating temperature (TINT(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (RθJA), as given by the following equation: TA(max)= TJ(max)–(RθJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum internal temperature of 105°C.
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX UNIT
VI
(2)
Voltage at VIN(3)
–0.3
6
V
Voltage at VIN (TPS826721) (3)
-0.3
5.5
Voltage at VOUT
–0.3
3.6
V
Voltage at EN, MODE
–0.3
VIN + 0.3
V
Power dissipation
Internally limited
TA
Operating temperature range(4)
–40
85
°C
TINT (max) Maximum internal operating temperature
125
°C
Tstg
Storage temperature
–55
125
°C


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