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TPS61031PWP Fiches technique(PDF) 4 Page - Texas Instruments |
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TPS61031PWP Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 33 page TPS61030, TPS61031, TPS61032 SLUS534G – SEPTEMBER 2002 – REVISED MARCH 2015 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VI Input voltage on LBI –0.3 3.6 V Input voltage on SW, VOUT, LBO, VBAT, SYNC, EN, FB –0.3 7 V TJ Maximum junction temperature –40 150 °C Tstg Storage temperature range –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 8.2 ESD Ratings MIN MAX UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –2000 2000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22- –1000 1000 C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions MIN NOM MAX UNIT VI Supply voltage at VBAT 1.8 5.5 V TA Operating ambient temperature range -40 85 °C TJ Operating virtual junction temperature range -40 125 °C 8.4 Thermal Information TPS6103x THERMAL METRIC(1) PWP RSA UNIT 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 46.9 35.5 RθJC(top) Junction-to-case (top) thermal resistance 25.8 36.7 RθJB Junction-to-board thermal resistance 19.4 12.9 °C/W ψJT Junction-to-top characterization parameter 0.8 0.5 ψJB Junction-to-board characterization parameter 19.3 12.9 RθJC(bot) Junction-to-case (bottom) thermal resistance 2.2 3.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2002–2015, Texas Instruments Incorporated Product Folder Links: TPS61030 TPS61031 TPS61032 |
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