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TPS25810ATWRVCRQ1 Fiches technique(PDF) 4 Page - Texas Instruments |
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TPS25810ATWRVCRQ1 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 35 page 4 TPS25810A-Q1 SLVSE37 – APRIL 2017 www.ti.com Product Folder Links: TPS25810A-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating ambient temperature range, voltages are with respect to GND (unless otherwise noted) (1) MIN MAX UNIT Pin voltage, V AUDIO, AUX, CC1, CC2, CHG, CHG_HI, CS, DEBUG, EN, FAULT, IN1, IN2, OUT, POL, REF, UFP, –0.3 7 V REF_RTN Internally connected to GND V Pin positive source current, ISRC CC1, CC2, OUT, REF Internally limited A Pin positive sink current, ISNK OUT (while applying VBUS) 5 A CC1, CC2 (while applying VCONN) 1 A AUDIO, CS, DEBUG, FAULT, POL, UFP Internally limited mA Operating junction temperature, TJ –40 180 °C Storage temperature range, Tstg –65 150 °C (1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges into the device. (2) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. (3) Surges per IEC61000-402, 1999 applied between CC1, CC2 and output ground of the TPS25810EVM-745. 7.2 ESD Ratings VALUE UNIT V(ESD) (1) Electrostatic discharge Human-body model (HBM), per per AEC Q100-002(2) ±2 000 V Charged-device model (CDM), per per AEC Q100-011 ±500 61000-4-2 contact discharge, CC1 and CC2(3) IEC ±8 000 IEC 61000-4-2 air discharge, CC1 and CC2(3) ±15 000 7.3 Recommended Operating Conditions Voltages are with respect to GND (unless otherwise noted) MIN NOM MAX UNIT VIN Supply voltage IN1 4.5 6.5 V IN2 4.5 5.5 AUX 2.9 5.5 VI Input voltage CHG, CHG_HI, EN 0 5.5 V VIH High-level input voltage CHG, CHG_HI, EN 1.17 V VIL Low-level voltage CHG, CHG_HI, EN 0.63 V VPU Pullup voltage Used on AUDIO, CS, DEBUG, FAULT, POL, UFP, 0 5.5 V ISRC Positive source current OUT 3 A CC1 or CC2 when supplying VCONN 250 mA ISNK Positive sink current (10 ms moving average) AUDIO, CS, DEBUG, FAULT, POL, UFP 10 mA ISNK_PULSE Positive repetitive pulse sink current AUDIO, CS, DEBUG, FAULT, POL, UFP Internally limited mA RREF Reference resistor 98 100 102 kΩ TJ Operating junction temperature –40 125 °C |
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