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TPA6205A1DRBT Fiches technique(PDF) 4 Page - Texas Instruments |
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TPA6205A1DRBT Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 38 page SLOS490TPA6205A1 SLOS490C – JULY 2006 – REVISED NOVEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD Supply voltage –0.3 6 V VI Input voltage INx and SHUTDOWN pins –0.3 0.3 V See Dissipation Continuous total power dissipation Ratings TA Operating free-air temperature –40 85 ºC TJ Junction temperature –40 125 ºC Lead temperature 1.6 mm (1/16 inch) from ZQV, DRB, DGN 260 ºC case for 10 seconds Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply voltage 2.5 5.5 V VIH High-level input voltage SHUTDOWN 1.15 V VIL Low-level input voltage SHUTDOWN 0.5 V VIC Common-mode input voltage VDD = 2.5 V, 5.5 V, CMRR ≤ –60 dB 0.5 VDD–0.8 V TA Operating free-air temperature –40 85 °C ZL Load impedance 6.4 8 Ω 7.4 Thermal Information TPA6205A1 BGA MICROSTAR MSOP THERMAL METRIC(1) SON UNIT JUNIOR PowerPAD 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 134.4 57.3 109.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 79.8 84.0 67.8 °C/W RθJB Junction-to-board thermal resistance 71.1 32.2 47.6 °C/W ψJT Junction-to-top characterization parameter 5.3 3.7 4.7 °C/W ψJB Junction-to-board characterization parameter 71.0 32.2 47.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 11.8 15.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: SLOS490TPA6205A1 |
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