TPA6133A2

SLOS821B – JUNE 2013 – REVISED SEPTEMBER 2014

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Table of Contents

8.2

Functional Block Diagram ....................................... 10

1

Features .................................................................. 1

8.3

Feature Description................................................. 11

2

Applications ........................................................... 1

8.4

Device Functional Modes........................................ 12

3

Description ............................................................. 1

9

Application and Implementation ........................ 13

4

Simplified Application Diagram............................ 1

9.1

Application Information............................................ 13

5

Revision History..................................................... 2

9.2

Typical Application ................................................. 13

6

Pin Configuration and Functions ......................... 3

10

Power Supply Recommendations ..................... 16

7

Specification........................................................... 4

11

Layout................................................................... 17

7.1

Absolute Maximum Ratings ..................................... 4

11.1

Layout Guidelimes ................................................ 17

7.2

Handling Ratings....................................................... 4

11.2

Layout Example .................................................... 17

7.3

Recommended Operating Conditions ....................... 4

12

Device and Documentation Support ................. 18

7.4

Thermal Information .................................................. 4

12.1

Trademarks ........................................................... 18

7.5

Electrical Characteristics........................................... 5

12.2

Electrostatic Discharge Caution ............................ 18

7.6

Operating Characteristics.......................................... 5

12.3

Glossary ................................................................ 18

7.7

Typical Characteristics .............................................. 6

13

Mechanical, Packaging, and Orderable

8

Detailed Description ............................................ 10

Information ........................................................... 18

8.1

Overview ................................................................. 10

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (August 2014) to Revision B

Page

•

Changed "PIN QFN" To: "NUMBER" in the Pin Functions table............................................................................................ 3

•

Added a NOTE to the Applications and Implementation section ........................................................................................ 13

•

Added new paragraph to the Application Information section .............................................................................................. 13

Changes from Original (June 2013) to Revision A

Page

•

Added Handling Rating table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1

•

Added the Device Information Table ..................................................................................................................................... 1

•

Moved "Minimum Load Impedance" From the Absolute Maximum Ratings table To the Recommended Operating

Conditions table ...................................................................................................................................................................... 4

•

Added the Thermal Information Table ................................................................................................................................... 4

•

Changed text in the Overview section From: "toggling the SD pin to logic 1." To: "asserting the SD pin to logic 1." ......... 10

•

Changed text in the Headphone Amplifier section From: "the output signal is severely clipped" To: "power

consumption will be higher" .................................................................................................................................................. 11

•

Added the Optional Test Setup section................................................................................................................................ 15

•

Added the Layout Example image ...................................................................................................................................... 17

2

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