1

2

3

4

8

7

6

5

IN1−

BYPASS

GND

IN2−

SHUTDOWN

3

TPA6111A2

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SLOS313C – DECEMBER 2000 – REVISED MARCH 2016

Product Folder Links: TPA6111A2

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5 Device Comparison Table

AVAILABLE OPTIONS

TPA6100A2

TPA6110A2

TPA6111A2

TPA6112A2

Headphone Channels

Stereo

Stereo

Stereo

Stereo

Output Power (W)

0.05

0.15

0.15

0.15

PSRR (dB)

72

83

83

83

Pin/Package

8-pin SOIC, 8-Pin

VSSOP

8-pin MSOP

8-pin MSOP, 8-Pin

SOIC

10-pin MSOP

6 Pin Configuration and Functions

D or DGN Package

8-Pin SOIC or MSOP

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

BYPASS

3

I

Tap to voltage divider for internal mid-supply bias supply. Connect to a 0.1-µF to 1-µF low ESR capacitor

for best performance.

GND

4

I

GND is the ground connection.

IN1–

2

I

IN1– is the inverting input for channel 1.

IN2–

6

I

IN2– is the inverting input for channel 2.

SHUTDO

WN

5

I

Puts the device in a low quiescent current mode when held high

8

I

1

O

7

O

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

6

V

Input voltage

–0.3

V

Continuous total power dissipation

Internally Limited

Operating junction temperature

–40

150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

Storage temperature

–65

150

°C