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STFI6N80K5 Fiches technique(PDF) 5 Page - STMicroelectronics

No de pièce STFI6N80K5
Description  Ultra low gate charge
Download  15 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STFI6N80K5 Fiches technique(HTML) 5 Page - STMicroelectronics

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DocID024664 Rev 4
5/15
STF6N80K5, STFI6N80K5
Electrical characteristics
15
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD
performance of the device. The Zener voltage facilitates efficient and cost-effective device
integrity protection,thus eliminating the need for additional external componentry.
Table 6. Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on delay time
VDD = 400 V, ID = 2.25 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 14: Switching
times test circuit for
resistive load and
Figure 19: Switching time
waveform)
-16
-
ns
tr
Rise time
-
7.5
-
ns
td(off)
Turn-off delay time
-
28.5
-
ns
tf
Fall time
-
16
-
ns
Table 7. Source drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
ISD
Source-drain current
-
4.5
A
ISDM
(1)
1.
Pulse width limited by safe operating area
Source-drain current (pulsed)
-
18
A
VSD
(2)
2.
Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Forward on voltage
ISD = 4.5 A, VGS = 0
-
1.5
V
trr
Reverse recovery time
ISD = 4.5 A, VDD = 60 V
di/dt = 100 A/µs,
(see Figure 16: Test
circuit for inductive load
switching and diode
recovery times)
-
280
ns
Qrr
Reverse recovery charge
-
2.2
μC
IRRM
Reverse recovery current
-
15.5
A
trr
Reverse recovery time
ISD = 4.5 A,VDD = 60 V
di/dt = 100 A/µs,
Tj = 150 °C
(see Figure 16: Test
circuit for inductive load
switching and diode
recovery times)
-
450
ns
Qrr
Reverse recovery charge
-
3.15
μC
IRRM
Reverse recovery current
-
14
A
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V(BR)GSO Gate-source breakdown voltage IGS = ±1mA, ID = 0
30
-
-
V


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