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STD2N105K5 Fiches technique(PDF) 5 Page - STMicroelectronics

No de pièce STD2N105K5
Description  N-channel 1050 V, 6 廓 typ., 1.5 A MDmesh??K5 Power MOSFETs in DPAK, TO-220 and IPAK packages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
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STD2N105K5 Fiches technique(HTML) 5 Page - STMicroelectronics

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STD2N105K5, STP2N105K5, STU2N105K5
Electrical characteristics
21
The built-in back-to-back Zener diodes have specifically been designed to enhance the
device's ESD capability. In this respect the Zener voltage is appropriate to achieve an
efficient and cost-effective intervention to protect the device's integrity. These integrated
Zener diodes thus avoid the usage of external components.
Table 6. Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max
Unit
td(on)
Turn-on delay time
VDD = 525 V, ID = 0.75 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 17)
-
14.5
-
ns
tr
Rise time
-
8.5
-
ns
td(off)
Turn-off-delay time
-
35
-
ns
tf
Fall time
-
38.5
-
ns
Table 7. Source drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max
Unit
ISD
Source-drain current
-
1.5
A
ISDM
(1)
1.
Pulse width limited by safe operating area
Source-drain current (pulsed)
-
6
A
VSD
(2)
2.
Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Forward on voltage
ISD = 1.5 A, VGS = 0
-
1.5
V
trr
Reverse recovery time
ISD = 1.5 A, di/dt = 100 A/µs
VDD= 60 V
(see Figure 19)
-
326
ns
Qrr
Reverse recovery charge
-
1.19
µC
IRRM
Reverse recovery current
-
7.3
A
trr
Reverse recovery time
ISD = 1.5 A, di/dt = 100 A/µs
VDD= 60 V TJ = 150 °C
(see Figure 19)
-
525
ns
Qrr
Reverse recovery charge
-
1.83
µC
IRRM
Reverse recovery current
-
7
A
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min
Typ.
Max.
Unit
V(BR)GSO Gate-source breakdown voltage IGS = ± 1mA, ID=0
30
-
-
V


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