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BALF-2690-02D3 Fiches technique(PDF) 5 Page - STMicroelectronics |
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BALF-2690-02D3 Fiches technique(HTML) 5 Page - STMicroelectronics |
5 / 9 page DocID025234 Rev 4 5/9 BALF-2690-02D3 Package information 2 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 Flip-Chip package information Figure 10. Flip-Chip package outline Table 4. Flip-Chip package mechanical data Parameter Description Min. Typ. Max. Unit A Bump height + substrate thickness 0.570 0.630 0.690 mm A1 Bump height 0.155 0.205 0.255 mm A2 Substrate thickness 0.400 mm b Bump diameter 0.215 0.255 0.295 mm D Y dimension of the die 1.590 1.640 1.690 mm D1 Y pitch 0.660 mm D2 Y pitch2 0.540 mm E X dimension of the die 0.890 0.940 0.990 mm E1 X pitch 0.500 mm fD Distance from bump to edge of die on Y axis 0.225 mm fE Distance from bump to edge of die on X axis 0.215 mm ccc 0.05 mm $0.025 mm |
Numéro de pièce similaire - BALF-2690-02D3 |
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Description similaire - BALF-2690-02D3 |
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