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BGA2012 Datasheet(Fiches technique) 4 Page - NXP Semiconductors

Numéro de pièce BGA2012
Description  1900 MHz high linear low noise amplifier
Télécharger  12 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BGA2012 Datasheet(HTML) 4 Page - NXP Semiconductors

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2000 Dec 04
4
Philips Semiconductors
Product specification
1900 MHz high linear low noise amplifier
BGA2012
APPLICATION INFORMATION
List of components (see Fig.2)
Note
1. The stripline (w = 0.7 mm) is on a gold plated double copper-clad printed-circuit board (
ε
r = 6.15),
board thickness = 0.64 mm, copper thickness = 35
µm, gold thickness = 5 µm.
COMPONENT
DESCRIPTION
TYPICAL
APPLICATION
HIGH IP3
APPLICATION
DIMENSIONS
C1, C2
multilayer ceramic chip capacitor
100 pF
100 pF
0603
C3, C5
multilayer ceramic chip capacitor
22 nF
22 nF
0603
C4
multilayer ceramic chip capacitor
−−−
C6
multilayer ceramic chip capacitor
100 nF
0805
L1
SMD inductor
3.9 nH
0603
L2
SMD inductor
3.9 nH
0603
handbook, full pagewidth
GND
OUT
stripline
BIAS
CIRCUIT
C1
C6
L1
VC
L2
RF in
VS
VC
IN
C4
SOT363
C5
C2
RF out
C3
VS
MLD470
Fig.2 Application circuit.


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