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ST-4 Fiches technique(PDF) 5 Page - Vishay Siliconix |
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ST-4 Fiches technique(HTML) 5 Page - Vishay Siliconix |
5 / 8 page www.vishay.com For technical questions contact: copalsupport@vishay.com Document Number: 58010 5 Revision: 06-Mar-06 ST-4 Vishay Surface Mount Cermet Trimmers (single turn) MECHANICAL SPECIFICATIONS Mechanical angle 240 ° (1 turn) Operating torque 10 mN m {102 gf cm} maximum Stop strength 30 mN m {306 gf cm} minimum Rotational life 100 cycles [ ΔR/R ≤ ± (2 Ω + 3 %] Thrust to rotor 5 N {0.51 kgf} minimum Solderability Sn-Pb: 235 °C, 2 s Sn-Cu (Lead (Pb)-free): 245 ± 3 °C, 2 ∼ 3 s Shear (Adhesion) 5 N {0.51 kgf} 10 s Substrate bending Width 90 mm, bend 3 mm, 5 s, 1 time Pull-off strength 5 N {0.51 kgf} 10 s ELECTRICAL SPECIFICATIONS Nominal resistance range 10 Ω ∼ 2 MΩ Resistance tolerance ± 20 % Power ratings 0.25 W (70 °C) 0 W (125 °C) Resistance law Linear law (B) Maximum input voltage DC200 V or power rating, whichever is smaller Maximum wiper current 100 mA or power rating, whichever is smaller Effective electrical turn 210 ° (1 turn) End resistance 1 % or 2 Ω, whichever is greater C.R.V. 1 % or 3 Ω, whichever is greater Operating temp. range - 55 ∼ 125 °C Temp. coefficient 10 Ω ∼ 50 Ω: ± 250 10-6 /°C maximum 100 Ω ∼ 2MΩ: ± 100 10-6 /°C maximum Insulation resistance 1000 M Ω minimum (DC500 V) Dielectric strength AC500 V, 60 s Net weight Approx. 0.12 g (ST-4A, B, C, D, F, EA, EB, EC, ED, EF) Approx. 0.22 g (ST-4G, H, EG, EH) ENVIRONMENTAL SPECIFICATIONS Test item Test conditions Specifications Thermal shock - 65 ∼ 125 °C (0.5 h), 5 cycles [ ΔR/R ≤ 2 %] [S.S. ≤ 1 %] Humidity - 10 ∼ 65 °C (Relative humidity 80 ∼ 98 %), 10 cycles, 240 h [ ΔR/R ≤ 2 %] Shock 981 m/s2, 6 ms 6 directions for 3 times each [ ΔR/R ≤ 1%] [S.S. ≤ 1 %] Vibration Amplitude 1.52 mm or Acceleration 196 m/s2, 10 ∼ 2000 Hz, 3 directions, 12 times each Load Life 70 °C, 0.25 W, 1000 h [ ΔR/R ≤ 3 %] [S.S. ≤ 1 %] Low temperature operation - 55 °C, 2 h [ ΔR/R ≤ 2 %] [S.S. ≤ 2 %] High temperature exposure 125 °C, 250 h [ ΔR/R ≤ 3 %] [S.S. ≤ 2 %] Immersion seal 85 °C, 60 s No leaks (No continuous bubbles) Soldering heat Sn-Pb 260 °C, 10 s or 215 °C, 35 s [ ΔR/R ≤ 1 %] Sn-Cu Flow: 260 °C ± 3 °C as the temperature in a pot of molten solder, immersion from head of terminal to backside of board, 5 ∼ 6 s, two times maximum Reflow: Peak temperature 255 °C (Please refer to the profile below.) Manual soldering: 350 ± 10 °C, 3 ∼ 4 s Reflow : two times maximum Peak : 250 Over 230°C Pre Heating Zone 180°C (°C) 250 200 150 100 50 150°C 90 ± 30 s 30 ± 10 s Soldering Zone Heating time °C +5 0 Reflow profile for soldering heat evolution |
Numéro de pièce similaire - ST-4 |
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Description similaire - ST-4 |
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