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HLMP-HM65 Fiches technique(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-HM65 Fiches technique(HTML) 10 Page - AVAGO TECHNOLOGIES LIMITED |
10 / 14 page Avago Technologies - 10 - HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Application Precautions If the PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If the surface mount must be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. The following table shows the recommended PC board plated through holes (PTH) size for LED component leads. Over-sizing the PTH can lead to a twisted LED after clinching. On the other hand, under-sizing the PTH can cause difficulty when inserting the TH LED. NOTE Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Application Precautions 1. The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. 2. LEDs do exhibit slightly different characteristics at different drive currents that might result in larger performance variations (such as intensity, wavelength, and forward voltage). The user is recommended to set the application current as close as possible to the test current to minimize these variations. 3. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, it is crucial to ensure that the reverse bias voltage does not exceed the allowable limit of the LED. LED Component Lead Size Diagonal Plated through Hole Diameter 0.45 × 0.45 mm (0.018 × 0.018 inch) 0.636 mm (0.025 in.) 0.98 to 1.08 mm (0.039 to 0.043 in.) 0.50 x 0.50 mm (0.020 × 0.020 inch) 0.707 mm (0.028 in.) 1.05 to 1.15 mm (0.041 to 0.045 in.) |
Numéro de pièce similaire - HLMP-HM65 |
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Description similaire - HLMP-HM65 |
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