AD5675R datasheet(9/28 Pages) AD

No de pièce	AD5675R

Description	Easy implementation

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AD5676

Data Sheet

Rev. B | Page 8 of 27

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 5.

Parameter

Rating

VDD to GND

−0.3 V to +7 V

VLOGIC to GND

−0.3 V to +7 V

VOUTx to GND

−0.3 V to VDD + 0.3 V

VREF to GND

−0.3 V to VDD + 0.3 V

Digital Input Voltage to GND

−0.3 V to VLOGIC + 0.3 V

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

125°C

Reflow Soldering Peak Temperature,

Pb-Free (J-STD-020)

260°C

ESD Ratings

Human Body Model (HBM)

2 kV

Field-Induced Charged Device Model

(FICDM)

1.5 kV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

The design of the thermal board requires close attention. Thermal

resistance is highly impacted by the printed circuit board (PCB)

being used, layout, and environmental conditions.

Table 6. Thermal Resistance

Package Type

θJA

θJB

θJC

ΨJT

ΨJB

Unit

20-Lead TSSOP

(RU-20)1

98.65

44.39

17.58

1.77

43.9

°C/W

20-Lead LFCSP

(CP-20-8)2

82

16.67

32.5

0.43

22

°C/W

1

Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board. See JEDEC JESD51

2

Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board with nine thermal vias. See JEDEC JESD51.

ESD CAUTION

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