BC846BM3T5G, NSVBC846BM3T5G

http://onsemi.com

5

PACKAGE DIMENSIONS

SOT−723

CASE 631AA

ISSUE D

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.45

0.50

0.55

b

0.15

0.21

0.27

b1

0.25

0.31

0.37

C

0.07

0.12

0.17

D

1.15

1.20

1.25

E

0.75

0.80

0.85

e

0.40 BSC

H

1.15

1.20

1.25

L

E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

D

b1

E

b

e

A

L

C

H

−Y−

−X−

X

0.08

Y

2X

E

1

2

3

STYLE 1:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

L2

0.15

0.20

0.25

0.29 REF

3X

L2

3X

1

2X

TOP VIEW

BOTTOM VIEW

SIDE VIEW

RECOMMENDED

DIMENSIONS: MILLIMETERS

0.40

1.50

2X

PACKAGE

OUTLINE

0.27

2X

0.52

3X

0.36

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