Moteur de recherche de fiches techniques de composants électroniques |
|
HLMP-HB70-TVCDD Fiches technique(PDF) 8 Page - AVAGO TECHNOLOGIES LIMITED |
|
HLMP-HB70-TVCDD Fiches technique(HTML) 8 Page - AVAGO TECHNOLOGIES LIMITED |
8 / 11 page Avago Technologies - 8 - HLMP-HM70/HM71, HLMP-HB70/HB71 Data Sheet Application Precautions The following table shows the recommended PC board plated through holes (PTH) size for LED component leads. Over-sizing the PTH can lead to a twisted LED after clinching. On the other hand, under-sizing the PTH can cause difficulty when inserting the TH LED. NOTE Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Application Precautions The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. LEDs do exhibit slightly different characteristics at different drive currents that might result in larger performance variations (such as intensity, wavelength, and forward voltage). The user is recommended to set the application current as close as possible to the test current to minimize these variations. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, it is crucial to ensure that the reverse bias voltage does not exceed the allowable limit of the LED. LED Component Lead Size Diagonal Plated Through Hole Diameter 0.45 × 0.45 mm (0.018 × 0.018 inch) 0.636 mm (0.025 in.) 0.98 to 1.08 mm (0.039 to 0.043 in.) 0.50 x 0.50 mm (0.020 × 0.020 inch) 0.707 mm (0.028 in.) 1.05 to 1.15 mm (0.041 to 0.045 in.) Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60 sec Max TIME (sec) 260°C Max 105°C Max |
Numéro de pièce similaire - HLMP-HB70-TVCDD |
|
Description similaire - HLMP-HB70-TVCDD |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |