4

TPS562219A, TPS563219A

SLVSDT2 – NOVEMBER 2016

www.ti.com

Product Folder Links: TPS562219A TPS563219A

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Input voltage range

VIN, EN

–0.3

19

V

VBST

–0.3

25

V

VBST (10 ns transient)

–0.3

27.5

V

VBST (vs SW)

–0.3

6.5

V

VFB, PG

–0.3

6.5

V

SS

–0.3

5.5

V

SW

–2

19

V

SW (10 ns transient)

–3.5

21

V

–40

150

°C

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2000

V

±500

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply input voltage range

4.5

17

V

Input voltage range

VBST

–0.1

23

V

VBST (10 ns transient)

–0.1

26

VBST(vs SW)

–0.1

6

EN

–0.1

17

VFB, PG

–0.1

5.5

SS

–0.1

5

SW

–1.8

17

SW (10 ns transient)

–3.5

20

Operating free-air temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TPS562219A

TPS563219A

UNIT

DDF (SOT)

8 PINS

Junction-to-ambient thermal resistance

106.1

87.0

°C/W

Junction-to-case (top) thermal resistance

49.1

41.6

°C/W

Junction-to-board thermal resistance

10.9

14.6

°C/W

Junction-to-top characterization parameter

8.6

4.7

°C/W

Junction-to-board characterization parameter

10.8

14.6

°C/W