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SI7218DN Fiches technique(PDF) 1 Page - Vishay Siliconix

No de pièce SI7218DN
Description  Dual N-Channel 30-V (D-S) MOSFET
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Fabricant  VISHAY [Vishay Siliconix]
Site Internet  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SI7218DN Fiches technique(HTML) 1 Page - Vishay Siliconix

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Vishay Siliconix
Si7218DN
Document Number: 73958
S-83044-Rev. C, 22-Dec-08
www.vishay.com
1
Dual N-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Available
TrenchFET® Power MOSFET
APPLICATIONS
Synchronous Rectification
Notebook System Power
POL
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
ID (A)
Qg (Typ.)
30
0.025 at VGS = 10 V
24
5 nC
0.033 at VGS = 4.5 V
21
1
2
3
4
5
6
7
8
S1
G1
S2
G2
D1
D1
D2
D2
3.30 mm
3.30 mm
PowerPAK® 1212-8
Bottom View
Ordering Information: Si7218DN-T1-E3 (Lead (Pb)-free)
Si7218DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
G1
D1
S1
N-Channel MOSFET
G2
D2
S2
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 94 °C/W.
f. Based on TC = 25 °C.
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
ID
24
A
TC = 70 °C
19
TA = 25 °C
8a, b
TA = 70 °C
6.5a, b
Pulsed Drain Current
IDM
35
Continuous Source-Drain Diode Current
TC = 25 °C
IS
19
TA = 25 °C
2.2a, b
Single Pulse Avalanche Current
L = 0.1 mH
IAS
10
Single Pulse Avalanche Energy
EAS
5
mJ
Maximum Power Dissipation
TC = 25 °C
PD
23
W
TC = 70 °C
14.8
TA = 25 °C
2.6a, b
TA = 70 °C
1.7a, b
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)c, d
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambienta, e
t
≤ 10 s
RthJA
38
48
°C/W
Maximum Junction-to-Case (Drain)
Steady State
RthJC
4.3
5.4


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