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TPPM0302 Fiches technique(PDF) 11 Page - Texas Instruments |
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TPPM0302 Fiches technique(HTML) 11 Page - Texas Instruments |
11 / 12 page TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 11 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA DGN (S-PDSO-G8) PowerPAD ™ PLASTIC SMALL-OUTLINE PACKAGE 0,69 0,41 0,25 Thermal Pad (See Note D) 0,15 NOM Gage Plane 4073271/A 04/98 4,98 0,25 5 3,05 4,78 2,95 8 4 3,05 2,95 1 0,38 0,15 0,05 1,07 MAX Seating Plane 0,10 0,65 M 0,25 0 °–6° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions include mold flash or protrusions. D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically and thermally connected to the backside of the die and possibly to selected leads. E. Falls within JEDEC MO-187 PowerPAD is a trademark of Texas Instruments. |
Numéro de pièce similaire - TPPM0302 |
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Description similaire - TPPM0302 |
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