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DLP6500

DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016

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Copyright © 2014–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 8

6.1

Absolute Maximum Ratings ...................................... 8

6.2

Storage Conditions.................................................... 8

6.3

ESD Ratings.............................................................. 9

6.4

Recommended Operating Conditions ....................... 9

6.5

Thermal Information ................................................ 11

6.6

Electrical Characteristics......................................... 12

6.7

Timing Requirements .............................................. 13

6.8

Typical Characteristics ............................................ 17

6.9

System Mounting Interface Loads .......................... 18

6.10

Micromirror Array Physical Characteristics ........... 19

6.11

Micromirror Array Optical Characteristics ............. 20

6.12

Window Characteristics......................................... 21

6.13

Chipset Component Usage Specification ............. 21

7

Detailed Description ............................................ 22

7.1

Overview ................................................................. 22

7.2

Functional Block Diagram ....................................... 23

7.3

Feature Description................................................. 24

7.4

Device Functional Modes........................................ 27

7.5

Window Characteristics and Optics ....................... 27

7.6

Micromirror Array Temperature Calculation............ 28

7.7

Micromirror Landed-on/Landed-Off Duty Cycle ...... 29

8

Application and Implementation ........................ 31

8.1

Application Information............................................ 31

8.2

Typical Application ................................................. 31

9

Power Supply Requirements .............................. 33

9.1

DMD Power Supply Requirements ........................ 33

9.2

DMD Power Supply Power-Up Procedure .............. 33

9.3

DMD Mirror Park Sequence Requirements ............ 33

9.4

DMD Power Supply Power-Down Procedure ......... 34

10

Layout................................................................... 37

10.1

Layout Guidelines ................................................. 37

10.2

Layout Example .................................................... 37

11

Device and Documentation Support ................. 42

11.1

Device Support...................................................... 42

11.2

Documentation Support ....................................... 43

11.3

Community Resources.......................................... 43

11.4

Trademarks ........................................................... 43

11.5

Electrostatic Discharge Caution ............................ 43

11.6

Glossary ................................................................ 43

12

Mechanical, Packaging, and Orderable

Information ........................................................... 43

4 Revision History

Changes from Original (October 2014) to Revision A

Page

•

Updated features to include additional digital controller......................................................................................................... 1

•

Added additional symplified diagram...................................................................................................................................... 1

•

Removed DLKC_C and DCLK_D, separated TCASE into TARRAY and TWINDOW, added TDELTA, and reduced

fclock in Absolute Maximum Ratings...................................................................................................................................... 8

•

Separated handling ratings into Storage Conditions and ESD Ratings. ................................................................................ 8

•

Changed TDMD to TARRAY, TGRADIENT to TDELTA, and added short term operational values in Recommended

Operating Conditions .............................................................................................................................................................. 9

•

Updated Micromirror Derating Curve.................................................................................................................................... 11

•

Added typical characteristics when DMD is controlled with the DLPC910........................................................................... 17

•

Update CL2W constant in Micromirror Array Termperature Calculation. ............................................................................. 28

•

Added recommended idle mode operation for maximizing mirror useful life. ...................................................................... 29

•

Added additional typical application schematic. ................................................................................................................... 31

•

Added DMD Mirror Park Sequence requirements. ............................................................................................................... 33

•

Added cross reference to DMD Mirror Park Sequence requirements.................................................................................. 34

•

Updated part number description and device markings. ...................................................................................................... 42