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TPS79428DCQ Fiches technique(PDF) 10 Page - Texas Instruments |
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TPS79428DCQ Fiches technique(HTML) 10 Page - Texas Instruments |
10 / 15 page www.ti.com Board Layout Recommendation to Improve PSRR and Noise Performance PCB Copper Area − in 100 80 40 0 1 2 3 120 140 THERMAL RESISTANCE vs PCB COPPER AREA 180 4 5 160 60 0 20 Surface-Mount Package 1 oz. Copper CIRCUIT BOARD COPPER AREA SOT223 Surface-Mount Package Power and Dissipation and Junction Temperature P D(max) + T J max * TA RθJA (1) P D + V IN * V OUT I OUT (2) Regulator Mounting TPS79401, TPS79418 TPS79425, TPS79428 TPS79430, TPS79433 SLVS349D – NOVEMBER 2001 – REVISED OCTOBER 2004 To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the ground pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the ground pin of the device. Figure 23. Thermal Resistance vs PCB Area for the SOT223-6. Specified regulator operation is assured to a junction temperature of 125 °C; the maximum junction temperature should be restricted to 125 °C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or equal to PD(max). The maximum-power-dissipation limit is determined using the following equation: where: • TJmax is the maximum allowable junction temperature. • R θ JA is the thermal resistence juntion-to-ambient for the package. See the power dissipation table and Figure 1 • TA is the ambient temperature. The regulator dissipation is calculated using: Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal protection circuit. The tab of the SOT223-6 package is electrically connected to ground. For best thermal performance, the tab of the surface-mount version should be soldered directly to a circuit-board copper area. Increasing the copper area improves heat dissipation. Solder pad footprint recommendations for the devices are presented in an application bulletin Solder Pad Recommendations for Surface-Mount Devices, literature number AB-132, available from the TI web site (www.ti.com). 10 |
Numéro de pièce similaire - TPS79428DCQ |
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Description similaire - TPS79428DCQ |
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