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SN74LVC2T45 Fiches technique(PDF) 1 Page - Texas Instruments

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No de pièce SN74LVC2T45
Description  DUAL BIT DUAL SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC2T45 Fiches technique(HTML) 1 Page - Texas Instruments

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SN74LVC2T45
DUALBIT DUALSUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3STATE OUTPUTS
SCES516E − DECEMBER 2003 − REVISED MAY 2004
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.65-V to
5.5-V Power-Supply Range
D VCC Isolation Feature − If Either VCC Input
Is at GND, Both Ports Are in the
High-Impedance State
D DIR Input Circuit Referenced to VCCA
D Low Power Consumption, 10-µA Max ICC
D ±24-mA Output Drive at 3.3 V
D Ioff Supports Partial-Power-Down Mode
Operation
D Max Data Rates
− 420 Mbps (3.3-V to 5-V Translation)
− 210 Mbps (Translate to 3.3 V)
− 140 Mbps (Translate to 2.5 V)
− 75 Mbps (Translate to 1.8 V)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
DCT OR DCU PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
VCCA
A1
A2
GND
VCCB
B1
B2
DIR
4
3
2
1
5
6
7
8
GND
A2
A1
VCCA
DIR
B2
B1
VCCB
YEP OR YZP PACKAGE
(BOTTOM VIEW)
description/ordering information
This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track VCCA. VCCA accepts any supply voltage from 1.65 V to 5.5 V. The B port is designed to track
VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional
translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
The SN74LVC2T45 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Reel of 3000
SN74LVC2T45YEPR
_ _ _TB_
−40 C to 85 C
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
SN74LVC2T45YZPR
_ _ _TB_
−40
°C to 85°C
SSOP − DCT
Reel of 3000
SN74LVC2T45DCTR
CT2_ _ _
SSOP − DCT
Reel of 250
SN74LVC2T45DCTT
CT2_ _ _
VSSOP − DCU
Reel of 3000
SN74LVC2T45DCUR
CT2_
VSSOP − DCU
Reel of 250
SN74LVC2T45DCUT
CT2_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
 2004, Texas Instruments Incorporated
NanoStar and NanoFree are trademarks of Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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