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SI8401DB-T1 Fiches technique(PDF) 5 Page - Vishay Siliconix |
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SI8401DB-T1 Fiches technique(HTML) 5 Page - Vishay Siliconix |
5 / 5 page Si8401DB Vishay Siliconix Document Number: 71674 S-40384—Rev. F, 01-Mar-04 www.vishay.com 5 PACKAGE OUTLINE MICRO FOOT: 4-BUMP (2 X 2, 0.8-mm PITCH) NOTES (Unless Otherwise Specified): 1. Laser mark on the silicon die back, coated with a thin metal. 2. Bumps are Eutectic solder 63/57 Sn/Pb. (Sn 3.8 Ag, 0.7 Cu for Pb-free bumps) 3. Non-solder mask defined copper landing pad. 4. The flat side of wafers is oriented at the bottom. Bump Note 2 8401 XXX Recommended Land Mark on Backside of Die Silicon 4 O 0.30 X 0.31 Note 3 Solder Mask O X 0.40 b Diamerter e e A A2 A1 e S D e S E MILLIMETERS* INCHES Dim Min Max Min Max A 0.600 0.650 0.0236 0.0256 A1 0.260 0.290 0.0102 0.0114 A2 0.340 0.360 0.0134 0.0142 b 0.370 0.410 0.0146 0.0161 D 1.520 1.600 0.0598 0.0630 E 1.520 1.600 0.0598 0.0630 e 0.750 0.850 0.0295 0.0335 S 0.370 0.380 0.0146 0.0150 * Use millimeters as the primary measurement. |
Numéro de pièce similaire - SI8401DB-T1 |
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Description similaire - SI8401DB-T1 |
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