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TSB82AA2-EP Fiches technique(PDF) 10 Page - Texas Instruments |
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TSB82AA2-EP Fiches technique(HTML) 10 Page - Texas Instruments |
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10 / 103 page  1--3 1.2 Features The TSB82AA2-EP device supports the following features: • Controlled Baseline -- One Assembly/Test Site, One Fabrication Site • Extended Temperature Performance of --40 °Cto85°C • Enhanced Diminishing Manufacturing Sources (DMS) Support • Enhanced Product-Change Notification • Qualification Pedigree† • Single 3.3-V supply (1.8-V internal core voltage with regulator) • 3.3-V and 5-V PCI signaling environments • Serial bus data rates of 100M bits/s, 200M bits/s, 400M bits/s, and 800M bits/s • Physical write posting of up to three outstanding transactions • Serial ROM or boot ROM interface supports 2-wire serial EEPROM devices • 33-MHz/64-bit and 33-MHz/32-bit selectable PCI interface • Multifunction terminal (MFUNC terminal 1): -- PCI_CLKRUN protocol per the PCI Mobile Design Guide -- General-purpose I/O -- CYCLEIN/CYCLEOUT for external cycle timer control for customized synchronization • PCI burst transfers and deep FIFOs to tolerate large host latency: -- Transmit FIFO—5K asynchronous -- Transmit FIFO—2K isochronous -- Receive FIFO—2K asynchronous -- Receive FIFO—2K isochronous • D0, D1, D2, and D3 power states and PME events per the PCI Bus Power Management Interface Specification • Programmable asynchronous transmit threshold • Isochronous receive dual-buffer mode • Out-of-order pipelining for asynchronous transmit requests • Register access fail interrupt when the PHY SYSCLK is not active • Initial bandwidth available and initial channels available registers • Digital video and audio performance enhancements • Fabricated in advanced low-power CMOS process • Packaged in 144-terminal LQFP (PGE) † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. |
Numéro de pièce similaire - TSB82AA2-EP_14 |
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Description similaire - TSB82AA2-EP_14 |
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