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TPS79933YZUT Fiches technique(PDF) 5 Page - Texas Instruments |
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TPS79933YZUT Fiches technique(HTML) 5 Page - Texas Instruments |
5 / 41 page TPS799 www.ti.com SBVS056K – JANUARY 2005 – REVISED JANUARY 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT IN –0.3 7.0 V Voltage(2) EN –0.3 VIN + 0.3 V OUT –0.3 VIN + 0.3 V Current OUT Internally limited mA Operating virtual junction, TJ –55 150 °C Temperature Storage temperature range, Tstg –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 Electrostatic V(ESD) V Charged device model (CDM), per JEDEC specification JESD22-C101, discharge ±500 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 2.7 6.5 V IOUT Output current 0.5 200 mA TJ Operating junction temperature –40 125 °C 6.4 Thermal Information TPS799 THERMAL METRIC(1) DDC (SOT) DRV (SON) YZU (DSBGA) UNIT 5 PINS 6 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 225.3 74.2 143.3 RθJC(top) Junction-to-case (top) thermal resistance 39.3 58.8 1.1 RθJB Junction-to-board thermal resistance 47.3 145.9 84.7 °C/W ψJT Junction-to-top characterization parameter 0.5 0.2 3.8 ψJB Junction-to-board characterization parameter 46.7 54.4 84.4 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 7.2 N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS799 |
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