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TPS79933YZUT Fiches technique(PDF) 5 Page - Texas Instruments

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No de pièce TPS79933YZUT
Description  200-mA, Low-Quiescent Current, Ultralow Noise, High-PSRR Low-Dropout Linear Regulator
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

TPS79933YZUT Fiches technique(HTML) 5 Page - Texas Instruments

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TPS799
www.ti.com
SBVS056K – JANUARY 2005 – REVISED JANUARY 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
IN
–0.3
7.0
V
Voltage(2)
EN
–0.3
VIN + 0.3
V
OUT
–0.3
VIN + 0.3
V
Current
OUT
Internally limited
mA
Operating virtual junction, TJ
–55
150
°C
Temperature
Storage temperature range, Tstg
–55
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to network ground terminal.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
Electrostatic
V(ESD)
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
discharge
±500
all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Input voltage
2.7
6.5
V
IOUT
Output current
0.5
200
mA
TJ
Operating junction temperature
–40
125
°C
6.4 Thermal Information
TPS799
THERMAL METRIC(1)
DDC (SOT)
DRV (SON)
YZU (DSBGA)
UNIT
5 PINS
6 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
225.3
74.2
143.3
RθJC(top)
Junction-to-case (top) thermal resistance
39.3
58.8
1.1
RθJB
Junction-to-board thermal resistance
47.3
145.9
84.7
°C/W
ψJT
Junction-to-top characterization parameter
0.5
0.2
3.8
ψJB
Junction-to-board characterization parameter
46.7
54.4
84.4
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
7.2
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2005–2015, Texas Instruments Incorporated
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