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TPS7A1901DRBT Fiches technique(PDF) 4 Page - Texas Instruments |
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TPS7A1901DRBT Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 23 page 4 TPS7A19 SBVS256A – MAY 2016 – REVISED SEPTEMBER 2016 www.ti.com Product Folder Links: TPS7A19 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. (3) The absolute maximum rating is VIN + 0.3 V or 22 V, whichever is lower. (4) The voltage at the DELAY pin must be lower than the VIN voltage. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range –40°C to 125°C(unless otherwise noted) (1) MIN MAX UNIT Voltage(2) Input IN, EN –0.3 45 V Output OUT(3) –0.3 VIN + 0.3 DELAY(4) –0.3 45 FB, PG –0.3 22 Current Peak output Internally limited Temperature Operating junction, TJ –40 150 °C Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input supply voltage 4 40 V VOUT Output voltage 1.5 18 V VEN Enable voltage 0 40 V TJ Operating junction temperature –40 125 °C (1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TPS7A19 UNIT DRB (VSON) 8 PINS RθJA Junction-to-ambient thermal resistance 48 °C/W RθJC(top) Junction-to-case (top) thermal resistance 56.3 °C/W RθJB Junction-to-board thermal resistance 22.4 °C/W ψJT Junction-to-top characterization parameter 0.9 °C/W ψJB Junction-to-board characterization parameter 22.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 4.6 °C/W |
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