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TPS65263 Fiches technique(PDF) 5 Page - Texas Instruments |
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TPS65263 Fiches technique(HTML) 5 Page - Texas Instruments |
5 / 44 page TPS65261, TPS65261-1 www.ti.com SLVSCD3B – DECEMBER 2013 – REVISED MAY 2014 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –55 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all -2000 2000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification -500 500 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT PVIN1, PVIN2, PVIN3,VIN 4.5 18 V LX1, LX2, LX3 (Maximum withstand voltage transient < 20 ns) -0.8 18 V BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively -0.1 6.8 V EN1, EN2, EN3, PGOOD, V7V, MODE, RESET, VDIV -0.1 6.3 V FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC -0.1 3 V TA Operating junction temperature -40 85 °C TJ Operating junction temperature -40 125 °C 7.4 Thermal Information TPS65261 THERMAL METRIC(1) UNIT RHB (32 PINS) RθJA Junction-to-ambient thermal resistance 31.6 RθJC(top) Junction-to-case (top) thermal resistance 23.4 RθJB Junction-to-board thermal resistance 6.1 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 6.1 RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 |
Numéro de pièce similaire - TPS65263 |
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Description similaire - TPS65263 |
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