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FDN327N Fiches technique(PDF) 4 Page - Fairchild Semiconductor |
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FDN327N Fiches technique(HTML) 4 Page - Fairchild Semiconductor |
4 / 5 page FDN327N Rev C (W) Typical Characteristics 0 1 2 3 4 5 0 2 4 6 Qg, GATE CHARGE (nC) ID = 2A V DS = 5V 15V 10V 0 100 200 300 400 500 600 0 4 8 12 16 20 VDS, DRAIN TO SOURCE VOLTAGE (V) C ISS CRSS C OSS f = 1MHz V GS = 0 V Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics. 0.01 0.1 1 10 100 0.1 1 10 100 VDS, DRAIN-SOURCE VOLTAGE (V) DC 1s 100ms RDS(ON) LIMIT VGS = 4.5V SINGLE PULSE RθJA = 270 o C/W TA = 25 o C 10ms 1ms 100µs 0 5 10 15 20 0.001 0.01 0.1 1 10 100 1000 t1, TIME (sec) SINGLE PULSE RθJA = 270°C/W TA = 25°C Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 RθJA(t) = r(t) + RθJA RθJA = 270 °C/W TJ - TA = P * RθJA(t) Duty Cycle, D = t1 / t2 P(pk) t1 t2 SINGLE PULSE 0.01 0.02 0.05 0.1 0.2 D = 0.5 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. |
Numéro de pièce similaire - FDN327N |
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Description similaire - FDN327N |
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