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TPS60202DGSRG4 Fiches technique(PDF) 5 Page - Texas Instruments |
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TPS60202DGSRG4 Fiches technique(HTML) 5 Page - Texas Instruments |
5 / 26 page 5 TPS60200, TPS60201, TPS60202, TPS60203 www.ti.com SLVS274A – MARCH 2000 – REVISED APRIL 2016 Product Folder Links: TPS60200 TPS60201 TPS60202 TPS60203 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage IN, OUT, EN, LBI, LBO, PG to GND –0.3 3.6 V C1+, C2+ to GND –0.3 VO + 0.3 C1–, C2– to GND –0.3 VI + 0.3 Continuous total power dissipation TA ≤ 25°C power rating 424 mW TA = 70°C power rating 187 TA = 85°C power rating 136 Continuous output current TPS60200, TPS60201 150 mA TPS60202, TPS60203 75 Junction temperature, TJ 150 °C Storage temperature, Tstg –55 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VI Input voltage 1.6 3.6 V Ci Input capacitor 2.2 µF C1, C2 Flying capacitors 1 µF CO Output capacitor 2.2 µF TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPS6020x UNIT DGS (MSOP) 10 PINS RθJA Junction-to-ambient thermal resistance 158.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 49.3 °C/W RθJB Junction-to-board thermal resistance 78.1 °C/W ψJT Junction-to-top characterization parameter 4.7 °C/W ψJB Junction-to-board characterization parameter 76.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W |
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