TPS2559

SLVSCL5 – JUNE 2014

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8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Voltage range

IN, OUT, EN, ILIM, FAULT

–0.3

7

V

IN to OUT

–7

7

V

OUT

Internally Limited

mA

Continuous FAULT sink current

20

mA

ILIM source current

Internally Limited

mA

–40 to OTSD2

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Voltages are referenced to GND unless otherwise noted.

8.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

–2

2

kV

Electrostatic

Charged device model (CDM), per JEDEC specification JESD22-C101, all

–500

500

V

discharge

–8/15

8/15

kV

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

(3)

Surges per EN61000-4-2, 1999 applied between USB and output ground of the TPS2559EVM (SLUUB15) evaluation module

(documentation available on the Web.) These were the test levels, not the failure threshold.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage, IN

2.5

6.5

V

Input voltage, EN

0

6.5

V

Continuous output current of OUT

5.5

A

Continuous FAULT sink current

10

mA

24.9

100

k

Ω

Operating junction temperature

-40

125

°C

(1)

8.4 Thermal Information

TPS2559

UNIT

DRC (10 PINS)

Junction-to-ambient thermal resistance

40.6

Junction-to-case (top) thermal resistance

45.5

Junction-to-board thermal resistance

15.9

°C/W

Junction-to-top characterization parameter

0.4

Junction-to-board characterization parameter

15.7

Junction-to-case (bottom) thermal resistance

2.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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