SN5407, SN5417, SN7407, SN7417

HEX BUFFERS/DRIVERS

WITH OPENCOLLECTOR HIGHVOLTAGE OUTPUTS

SDLS032G − DECEMBER 1983 − REVISED MAY 2004

2

POST OFFICE BOX 655303

description/ordering information (continued)

These circuits are completely compatible with most TTL families. Inputs are diode clamped to minimize

transmission-line effects, which simplifies design. Typical power dissipation is 145 mW, and average

propagation delay time is 14 ns.

logic diagram, each buffer/driver (positive logic)

AY

schematic

Resistor values shown are nominal.

6 k

Ω

Input A

Output Y

GND

VCC

3.4 k

Ω

1.6 k

Ω

100

Ω

1 k

Ω

7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

30 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SN5417, SN7417

15 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

86

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N package

80

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NS package

76

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. All voltage values are with respect to GND.

2. This is the maximum voltage that should be applied to any output when it is in the off state.

3. The package thermal impedance is calculated in accordance with JESD 51-7.