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SN74AS174D Fiches technique(PDF) 10 Page - Texas Instruments

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No de pièce SN74AS174D
Description  HEX/QUADRUPLE D-TYPE FLIP-FLOPS
Download  21 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

SN74AS174D Fiches technique(HTML) 10 Page - Texas Instruments

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PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Addendum-Page 3
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
SNJ54ALS174FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
83019012A
SNJ54ALS
174FK
SNJ54ALS174J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8301901EA
SNJ54ALS174J
SNJ54ALS174W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8301901FA
SNJ54ALS174W
SNJ54ALS175J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8301902EA
SNJ54ALS175J
SNJ54AS174J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54AS174J
SNJ54AS175BJ
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9553701QE
A
SNJ54AS175BJ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.


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