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TLC2272ACDG4 Fiches technique(PDF) 6 Page - Texas Instruments |
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TLC2272ACDG4 Fiches technique(HTML) 6 Page - Texas Instruments |
6 / 63 page 6 TLC2272, TLC2272A, TLC2272M, TLC2272AM TLC2274, TLC2274A, TLC2274M, TLC2274AM SLOS190H – FEBRUARY 1997 – REVISED MARCH 2016 www.ti.com Product Folder Links: TLC2272 TLC2272A TLC2272M TLC2272AM TLC2274 TLC2274A TLC2274M TLC2274AM Submit Documentation Feedback Copyright © 1997–2016, Texas Instruments Incorporated Recommended Operating Conditions (continued) MIN MAX UNIT TA Operating free-air temperature C LEVEL PARTS 0 70 °C I LEVEL PARTS –40 125 Q LEVEL PARTS –40 125 M LEVEL PARTS –55 125 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. (3) The package thermal impedance is calculated in accordance with JESD 51-7 (plastic) or MIL-STD-883 Method 1012 (ceramic). 6.4 Thermal Information THERMAL METRIC(1) TLC2272 TLC2274 UNIT D (SOIC) P (PDIP) PW (TSSOP) FK (LCCC) U (CFP) D (SOIC) N (PDIP) PW (TSSOP) FK (LCCC) J (CDIP) 8-PIN 8-PIN 8-PIN 20-PIN 10-PIN 14-PIN 14-PIN 14-PIN 20-PIN 14-PIN RθJA Junction-to-ambient thermal resistance (2)(3) 115.6 58.5 175.8 — — 83.8 — 111.6 — — °C/W RθJC(top) Junction-to-case (top) thermal resistance (2)(3) 61.8 48.3 58.8 18 121.3 43.2 34 41.2 16 16.2 °C/W RθJB Junction-to-board thermal resistance 55.9 35.6 104.3 — — 38.4 — 54.7 — — °C/W ψJT Junction-to-top characterization parameter 14.3 25.9 5.9 — — 9.4 — 3.9 — — °C/W ψJB Junction-to-board characterization parameter 55.4 35.5 102.6 — — 38.1 — 53.9 — — °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — 8.68 — — — — — °C/W (1) TA = –55°C to 125°C. (2) Typical values are based on the input offset voltage shift observed through 168 hours of operating life test at TA = 150°C extrapolated to TA = 25°C using the Arrhenius equation and assuming an activation energy of 0.96 eV. 6.5 TLC2272 and TLC2272A Electrical Characteristics VDD = 5 V at specified free-air temperature, VDD = 5 V; TA = 25°C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIO Input offset voltage VIC = 0 V, VDD± = ±2.5 V, VO = 0 V, RS = 50 Ω TLC2272 TA = 25°C 300 2500 µV TLC2272A 300 950 TLC2272 Full Range(1) 3000 TLC2272A 1500 αVIO Temperature coefficient of input offset voltage VIC = 0 V, VDD± = ±2.5 V, VO = 0 V, RS = 50 Ω 2 μV/°C Input offset voltage long-term drift(2) VIC = 0 V, VDD± = ±2.5 V, VO = 0 V, RS = 50 Ω 0.002 μV/mo IIO Input offset current VIC = 0 V, VDD± = ±2.5 V, VO = 0 V, RS = 50 Ω All level parts TA = 25°C 0.5 60 pA C level part TA = 0°C to 80°C 100 I level part TA = –40°C to 85°C 150 Q level part TA = –40°C to 125°C 800 M level part TA = –55°C to 125°C 800 IIB Input bias current VIC = 0 V, VDD± = ±2.5 V, VO = 0 V, RS = 50 Ω All level parts TA = 25°C 1 60 pA C level part TA = 0°C to 80°C 100 I level part TA = –40°C to 85°C 150 Q level part TA = –40°C to 125°C 800 M level part TA = –55°C to 125°C 800 VICR Common-mode input voltage RS = 50 Ω; |VIO | ≤ 5 mV TA = 25°C –0.3 2.5 4 V Full Range(1) 0 2.5 3.5 |
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