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TLC2201ID Fiches technique(PDF) 6 Page - Texas Instruments |
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TLC2201ID Fiches technique(HTML) 6 Page - Texas Instruments |
6 / 70 page TLC220x, TLC220xA, TLC220xB, TLC220xY Advanced LinCMOS LOW NOISE PRECISION OPERATIONAL AMPLIFIERS SLOS175B − FEBRUARY 1997 − REVISED JANUARY 2008 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC2202Y chip formation This chip, when properly assembled, displays characteristics similar to the TLC2202C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + − 1OUT 1IN + 1IN − VDD+ (8) (6) (3) (2) (5) (1) − + (7) 2IN + 2IN − 2OUT (4) VDD− 100 80 (1) (2) (3) (4) (5) (6) (7) (8) |
Numéro de pièce similaire - TLC2201ID |
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Description similaire - TLC2201ID |
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